公开(公告)号：US20240021366A1

公开(公告)日：2024-01-18

申请号：US18353863

申请日：2023-07-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyoWang KOO ,  MinHee JEONG

IPC: H01G2/10 ,  H01L25/16 ,  H05K9/00 ,  H01F27/02 ,  H01F41/00 ,  H01C7/00 ,  H01C17/00

CPC classification number: H01G2/10 ,  H01L25/16 ,  H05K9/0024 ,  H01F27/022 ,  H01F41/005 ,  H01C7/00 ,  H01C17/00

Abstract: An electronic package comprises: a substrate; five-sided insulated electronic components, wherein each of the five-sided insulated electronic components comprises: a raw electronic component having a cuboid shape, wherein the raw electronic component has a bottom side at which the raw electronic component is mounted onto and connected with the substrate and five non-bottom sides; a conductive structure disposed on the bottom side of the raw electronic component; and an insulating layer disposed on the five non-bottom sides of the raw electronic component.