公开(公告)号：US11776861B2

公开(公告)日：2023-10-03

申请号：US17447041

申请日：2021-09-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Bokyeong Hwang ,  Jingwan Kim ,  Minjung Kim

IPC: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/00

CPC classification number: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/0024 ,  H05K9/0032 ,  H05K9/0033 ,  H01L2021/60082

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

公开(公告)号：US20230402332A1

公开(公告)日：2023-12-14

申请号：US18454709

申请日：2023-08-23

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Bokyeong Hwang ,  Jingwan Kim ,  Minjung Kim

IPC: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/00

CPC classification number: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/0033 ,  H05K9/0024 ,  H05K9/0032 ,  H01L2021/60082

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

公开(公告)号：US20230071960A1

公开(公告)日：2023-03-09

申请号：US17447041

申请日：2021-09-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Bokyeong Hwang ,  Jingwan Kim ,  Minjung Kim

IPC: H01L23/051 ,  H01L23/049 ,  H01L21/60

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.