公开(公告)号：US20230395477A1

公开(公告)日：2023-12-07

申请号：US17805096

申请日：2022-06-02

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  HeeSoo Lee ,  SangHyun Son ,  Bokyeong Hwang

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a side surface of the interconnect substrate. The electrical interconnect compound can be applied with a tilt nozzle oriented at an angle. A second electrical component is disposed on the electrical interconnect compound on the conductive via exposed from the side surface of the interconnect substrate. A plurality of second electrical components can be disposed on two or more side surfaces of the interconnect substrate. The interconnect substrate can have a plurality of stacked conductive vias and the second electrical component is disposed over the stacked conductive vias. An encapsulant is deposited over the first electrical component and interconnect substrate. A shielding layer can be formed over the encapsulant.

公开(公告)号：US11776861B2

公开(公告)日：2023-10-03

申请号：US17447041

申请日：2021-09-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Bokyeong Hwang ,  Jingwan Kim ,  Minjung Kim

IPC: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/00

CPC classification number: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/0024 ,  H05K9/0032 ,  H05K9/0033 ,  H01L2021/60082

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

公开(公告)号：US20230402332A1

公开(公告)日：2023-12-14

申请号：US18454709

申请日：2023-08-23

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Bokyeong Hwang ,  Jingwan Kim ,  Minjung Kim

IPC: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/00

CPC classification number: H01L23/051 ,  H01L21/60 ,  H01L23/049 ,  H05K9/0033 ,  H05K9/0024 ,  H05K9/0032 ,  H01L2021/60082

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

公开(公告)号：US20230071960A1

公开(公告)日：2023-03-09

申请号：US17447041

申请日：2021-09-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Bokyeong Hwang ,  Jingwan Kim ,  Minjung Kim

IPC: H01L23/051 ,  H01L23/049 ,  H01L21/60

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.