公开(公告)号：US20230137239A1

公开(公告)日：2023-05-04

申请号：US17970336

申请日：2022-10-20

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Younes BOUTALEB ,  David KAIRE ,  Romain COFFY

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/053 ,  H01L21/52

Abstract: The present description concerns an electronic device comprising: an electronic chip comprising an active area on a first surface, and a second surface opposite to the first surface; a substrate, the first surface of said chip being mounted on a third surface of said substrate; and a thermally-conductive cover comprising a transverse portion extending at least above the second surface of said electronic chip, wherein the electronic device further comprises at least one thermally-conductive pillar coupling the second surface of the electronic chip to said transverse portion of said thermally-conductive cover.

公开(公告)号：US20200335466A1

公开(公告)日：2020-10-22

申请号：US16847934

申请日：2020-04-14

Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Laurent SCHWARTZ ,  David KAIRE ,  Jerome LOPEZ

IPC: H01L23/00

Abstract: A bumping matrix includes many bumps, wherein each bump is rotationally asymmetric in a plane of the bumping matrix. The bumps are orientated in a centripetal arrangement. Bumps in a first portion of the bumping matrix have a first pitch in a first axis and bumps in a second portion of the bumping matrix have a second pitch in the first axis. The second pitch is different from the first pitch. Bumps have an oblong shape with a longer diameter and a shorter diameter. The centripetal arrangement orients the longer diameter of the bumps is a direction radially extending from a center of the bumping matrix.