公开(公告)号：US11699224B2

公开(公告)日：2023-07-11

申请号：US17522541

申请日：2021-11-09

Applicant: STMICROELECTRONICS (ROUSSET) SAS

Inventor： Laurent Bidault

IPC: G06T7/00 ,  G06N3/04 ,  G06N3/08 ,  G06F18/214 ,  G06F18/2431 ,  G06V10/764 ,  G06V10/77 ,  G06V10/774 ,  G06V10/776 ,  G06V10/82

CPC classification number: G06T7/0004 ,  G06F18/214 ,  G06F18/2431 ,  G06N3/04 ,  G06N3/08 ,  G06V10/764 ,  G06V10/774 ,  G06V10/776 ,  G06V10/7715 ,  G06V10/82 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148 ,  G06V2201/06

Abstract: A device includes image generation circuitry and convolutional-neural-network circuitry. The image generation circuitry, in operation, generates a digital image representation of a wafer defect map (WDM). The convolutional-neural-network circuitry, in operation, generates a defect classification associated with the WDM based on: the digital image representation of the WDM and a data-driven model associating WDM images with classes of a defined set of classes of wafer defects and generated using a training data set augmented based on defect pattern orientation types associated with training images.

公开(公告)号：US11501424B2

公开(公告)日：2022-11-15

申请号：US16687345

申请日：2019-11-18

Applicant: STMICROELECTRONICS (ROUSSET) SAS

Inventor： Laurent Bidault

IPC: G06T7/00 ,  G06N3/04

Abstract: A device includes image generation circuitry and convolutional-neural-network circuitry. The image generation circuitry, in operation, generates a digital image representation of a wafer defect map (WDM). The convolutional-neural-network circuitry, in operation, generates a defect classification associated with the WDM based on the digital image representation of the WDM and a data-driven model generated using an artificial wafer defect digital image (AWDI) data set and associating AWDIs with classes of a defined set of classes of wafer defects. A wafer manufacturing process may be controlled based on the classifications of WDMs.

公开(公告)号：US11200659B2

公开(公告)日：2021-12-14

申请号：US16687349

申请日：2019-11-18

Applicant: STMICROELECTRONICS (ROUSSET) SAS

Inventor： Laurent Bidault

IPC: G06T7/00 ,  G06K9/62 ,  G06N3/04 ,  G06N3/08

Abstract: A device includes image generation circuitry and convolutional-neural-network circuitry. The image generation circuitry, in operation, generates a digital image representation of a wafer defect map (WDM). The convolutional-neural-network circuitry, in operation, generates a defect classification associated with the WDM based on: the digital image representation of the WDM and a data-driven model associating WDM images with classes of a defined set of classes of wafer defects and generated using a training data set augmented based on defect pattern orientation types associated with training images.