公开(公告)号：US20140105717A1

公开(公告)日：2014-04-17

申请号：US13651562

申请日：2012-10-15

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD

Inventor： Hk LOOI ,  Cheng-hai CHEH ,  HaiKin TOH

IPC: B25J15/06

CPC classification number: B25J15/0616 ,  H05K13/0404 ,  H05K13/0408 ,  H05K13/0409 ,  Y10S901/40 ,  Y10T29/53178 ,  Y10T29/53191

Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

Abstract translation: PNP装置可以包括机器人臂和由机器人手臂承载的PNP工具头。 PNP工具头可以包括构造成将粘合压力施加到电子设备的第一区域的主体，以及拾取尖端，当拾取尖端抵靠在主体上时，拾取尖端可相对于主体在延伸位置和缩回位置之间移动 电子设备的第二区域。 拾取尖端可以限定穿过其中的真空通道以将真空源耦合到电子设备的第二区域。