公开(公告)号：US11983594B2

公开(公告)日：2024-05-14

申请号：US17587645

申请日：2022-01-28

申请人： STMICROELECTRONICS ASIA PACIFIC PTE LTD

发明人： Jaehyun Kwak ,  Kyoung Min Cho

IPC分类号： G06K19/077 ,  G06K19/073 ,  H01H1/12

CPC分类号： G06K19/07749 ,  G06K19/07345 ,  H01H1/12 ,  H01H2231/05

摘要： The present disclosure is directed to a contactless card including an actuation security structure that is actuated to provide authorization in accessing identifying information on an integrated circuit within the contactless card. In at least one embodiment, the actuation security structure includes a pair of conductive layers and a pair of electrodes. Ends of the pair of conductive layers overlap respective ones of the pair of electrodes. The ends of the pair of conductive layers are at and in a first elastically deformable region and the respective ones of the pair of electrodes are at and in a second elastically deformable region. An owner of the contactless card may provide authorization to access the identification information on the contactless card by applying force to both the first and second elastically deformable regions inward resulting in the ends of the conductive layers moving into electrical communication with the pair of electrodes.