公开(公告)号：US20140110565A1

公开(公告)日：2014-04-24

申请号：US13656912

申请日：2012-10-22

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.

Inventor： Jerome Teysseyre ,  Yonggang Jin

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14625 ,  H01L24/97 ,  H01L27/14618 ,  H01L2924/12042 ,  H01L2924/00

Abstract: An image sensor device may include a bottom interconnect layer, an image sensing IC above the bottom interconnect layer and coupled thereto, and an adhesive material on the image sensing IC. The image sensor device may include an IR filter layer above the lens layer, and an encapsulation material on the bottom interconnect layer and surrounding the image sensing IC, the lens layer, and the IR filter layer. The image sensor device may include a top contact layer above the encapsulation material and including a dielectric layer, and a contact thereon, the dielectric layer being flush with adjacent portions of the IR filter layer.

Abstract translation: 图像传感器装置可以包括底部互连层，在底部互连层上方并耦合到其上的图像感测IC以及图像感测IC上的粘合剂材料。 图像传感器装置可以包括在透镜层上方的IR滤光层，以及在底部互连层上的包围材料，并围绕图像感测IC，透镜层和IR滤光层。 图像传感器装置可以包括在封装材料上方的顶部接触层，并且包括介电层及其上的接触件，该介电层与IR滤光器层的相邻部分齐平。

公开(公告)号：US09059058B2

公开(公告)日：2015-06-16

申请号：US13656912

申请日：2012-10-22

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)

Inventor： Jerome Teysseyre ,  Yonggang Jin

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14625 ,  H01L24/97 ,  H01L27/14618 ,  H01L2924/12042 ,  H01L2924/00

Abstract: An image sensor device may include a bottom interconnect layer, an image sensing IC above the bottom interconnect layer and coupled thereto, and an adhesive material on the image sensing IC. The image sensor device may include an IR filter layer above the lens layer, and an encapsulation material on the bottom interconnect layer and surrounding the image sensing IC, the lens layer, and the IR filter layer. The image sensor device may include a top contact layer above the encapsulation material and including a dielectric layer, and a contact thereon, the dielectric layer being flush with adjacent portions of the IR filter layer.

Abstract translation: 图像传感器装置可以包括底部互连层，在底部互连层上方并耦合到其上的图像感测IC以及图像感测IC上的粘合剂材料。 图像传感器装置可以包括在透镜层上方的IR滤光层，以及在底部互连层上的包围材料，并围绕图像感测IC，透镜层和IR滤光层。 图像传感器装置可以包括在封装材料上方的顶部接触层，并且包括介电层及其上的接触件，该介电层与IR滤光器层的相邻部分齐平。