公开(公告)号：US20230307302A1

公开(公告)日：2023-09-28

申请号：US18184436

申请日：2023-03-15

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS PTE LTD

Inventor： David GANI ,  Hui-Tzu Wang

IPC: H01L23/04 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/04 ,  H01L25/0655 ,  H01L24/32 ,  H01L2924/16151 ,  H01L2924/16788 ,  H01L2224/32225

Abstract: A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.