公开(公告)号：US20150028187A1

公开(公告)日：2015-01-29

申请号：US13948507

申请日：2013-07-23

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Bin-Hong HUANG

IPC: H01L31/18 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2224/16225

Abstract: An image sensor device may include a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity, an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening, and an adhesive bead on the image sensor IC surrounding the image sensing area. Furthermore, an infrared (IR) filter may be within the filter-receiving opening and have peripheral portions contacting the adhesive bead.

Abstract translation: 图像传感器装置可以包括其中具有IC接收腔的安装基板和与IC接收腔对准的滤光器接收开口，IC接收腔内的图像传感器集成电路（IC），并且具有图像感测区域 与过滤器接收开口对准，以及围绕图像感测区域的图像传感器IC上的粘合剂珠粒。 此外，红外（IR）滤光器可以在过滤器接收开口内，并且具有与粘合剂珠接触的周边部分。