公开(公告)号：US20200168464A1

公开(公告)日：2020-05-28

申请号：US16690673

申请日：2019-11-21

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Tien Choy LOH

IPC: H01L21/3065 ,  H01L21/02 ,  H01L21/67

Abstract: One or more embodiments are directed to methods of removing a sacrificial layer from semiconductor wafers during wafer processing. In at least one embodiment, the sacrificial layer is removed from a wafer during an O2 plasma etch step. In one embodiment, the sacrificial layer is poly(p-phenylene-2, 6-benzobisoxazole) (PBO) or polyimide. The O2 plasma etch step causes a residue to form on the wafer. The residue is removed by immersing the wafer a solution that is a mixture of the tetramethylammonium hydroxide (TMAH) and water.

公开(公告)号：US20150210539A1

公开(公告)日：2015-07-30

申请号：US14679906

申请日：2015-04-06

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Olivier LE NEEL ,  Tien Choy LOH

IPC: B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2203/0127

Abstract: The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the cavities, and a plurality of diamond shaped anchors positioned between the membrane and the substrate, the anchors positioned between each of the cavities. A center of each opening is also a center of one of the cavities.

Abstract translation: 本公开涉及一种包括基板和形成在基板上的传感器的装置。 所述传感器包括由多个集成腔体形成的室，在所述衬底上方的膜，所述膜具有多个开口，每个开口位于所述空腔中的一个上方，以及多个位于所述膜和所述衬底之间的菱形锚定件 ，定位在每个空腔之间的锚固件。 每个开口的中心也是其中一个空腔的中心。