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公开(公告)号：US10935444B2
公开(公告)日：2021-03-02
申请号：US15957819
申请日：2018-04-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Elio Guidetti , Mohammad Abbasi Gavarti , Daniele Caltabiano , Gabriele Bertagnoli
Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.
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