公开(公告)号：US20200095114A1

公开(公告)日：2020-03-26

申请号：US16560518

申请日：2019-09-04

Applicant: STMicroelectronics S.r.l.

Inventor： Anna Angela Pomarico ,  Giuditta Roselli ,  Daniele Caltabiano ,  Roberto Brioschi ,  Mohammad Abbasi Gavarti

IPC: B81B3/00 ,  B60T1/06 ,  B60T8/171 ,  B60T8/17 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

公开(公告)号：US20160349129A1

公开(公告)日：2016-12-01

申请号：US14989709

申请日：2016-01-06

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Bruno Murari ,  Marco Ferrera ,  Domenico Giusti ,  Daniele Caltabiano

IPC: G01L9/00

CPC classification number: G01L9/0052 ,  G01L9/0054 ,  G01L15/00

Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

Abstract translation: 具有双重测量刻度的压力传感器包括：柔性体，设计成作为压力的函数进行偏转; 用于检测偏转的压阻传感器; 第一聚焦区域，设计成在第一操作条件期间将柔性体的第一部分中的压力的​​第一值集中以产生柔性体的第一部分的偏转; 以及设计成在第二操作条件期间将所述压力的第二值集中在柔性体的第二部分中以便产生柔性体的第二部分的偏转的第二聚焦区域。 压阻传感器将柔性体的第一部分的偏转与第一压力值和柔性体的第二部分的偏转相关联到第二压力值。

公开(公告)号：US11054319B2

公开(公告)日：2021-07-06

申请号：US17018276

申请日：2020-09-11

Applicant: STMicroelectronics S.r.l.

Inventor： Daniele Caltabiano

IPC: G01L1/22 ,  G01B7/16 ,  G01D5/16 ,  G01L1/04 ,  G01L1/06 ,  G01L1/18 ,  G01L19/00 ,  G01L9/04 ,  G01L9/00

Abstract: A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

公开(公告)号：US10527512B2

公开(公告)日：2020-01-07

申请号：US15783894

申请日：2017-10-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Bruno Murari ,  Marco Ferrera ,  Domenico Giusti ,  Daniele Caltabiano

IPC: G01L9/00 ,  G01L9/06 ,  G01L15/00

Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

公开(公告)号：US20190252556A1

公开(公告)日：2019-08-15

申请号：US15895513

申请日：2018-02-13

Applicant: STMicroelectronics S.r.l.

Inventor： Mohammad Abbasi Gavarti ,  Daniele Caltabiano ,  Marco Omar Ghidoni

IPC: H01L29/84 ,  H01L23/047 ,  H01L23/00 ,  H01L23/06 ,  H01L29/16 ,  H01L23/10 ,  H01L29/06 ,  G01L1/18

CPC classification number: H01L29/84 ,  G01L1/18 ,  H01L23/047 ,  H01L23/06 ,  H01L23/10 ,  H01L24/05 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L29/0657 ,  H01L29/16 ,  H01L2224/04042 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48105 ,  H01L2224/48155 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01032

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

公开(公告)号：US20170343430A1

公开(公告)日：2017-11-30

申请号：US15464869

申请日：2017-03-21

Applicant: STMicroelectronics S.r.l.

Inventor： Daniele Caltabiano ,  Mohammad Abbasi Gavarti ,  Bruno Murari ,  Roberto Brioschi ,  Domenico Giusti

IPC: G01L1/18

CPC classification number: G01L1/18 ,  G01L1/04 ,  G01L9/0041

Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.

公开(公告)号：US11851319B2

公开(公告)日：2023-12-26

申请号：US16560518

申请日：2019-09-04

Applicant: STMicroelectronics S.r.l.

Inventor： Anna Angela Pomarico ,  Giuditta Roselli ,  Daniele Caltabiano ,  Roberto Brioschi ,  Mohammad Abbasi Gavarti

IPC: B81B3/00 ,  B60T1/06 ,  B60T8/17 ,  B60T8/171 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06

CPC classification number: B81B3/0072 ,  B60T1/065 ,  B60T8/17 ,  B60T8/171 ,  G01L1/18 ,  G01L3/00 ,  G01L9/06 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/0315

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

公开(公告)号：US10985131B2

公开(公告)日：2021-04-20

申请号：US16830613

申请日：2020-03-26

Applicant: STMicroelectronics S.r.l.

Inventor： Daniele Caltabiano ,  Agatino Minotti

IPC: H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H01L23/538

Abstract: A microelectronic device includes a chip housing a functional part and carrying first electrical contact regions in electrical connection with the functional part through first protected connections extending over or in the chip. A substrate has a first contact area and a second contact area, which is remote from the first contact area. The first contact area carries second electrical contact regions, and the second contact area carries external connection regions. The second contact regions and the external connection regions are in mutual electrical connection through second protected connections extending over or in the substrate. A protection-ring structure surrounds the first and second electrical contact regions and delimits a first chamber closed with respect to the outside. The first electrical contact regions and the second electrical contact regions are in mutual electrical contact.

公开(公告)号：US10935444B2

公开(公告)日：2021-03-02

申请号：US15957819

申请日：2018-04-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Elio Guidetti ,  Mohammad Abbasi Gavarti ,  Daniele Caltabiano ,  Gabriele Bertagnoli

IPC: G01L1/18 ,  G01L25/00 ,  G01L5/162 ,  G01M5/00

Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.

公开(公告)号：US20200227375A1

公开(公告)日：2020-07-16

申请号：US16830613

申请日：2020-03-26

Applicant: STMicroelectronics S.r.l.

Inventor： Daniele Caltabiano ,  Agatino Minotti

IPC: H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/498

Abstract: A microelectronic device includes a chip housing a functional part and carrying first electrical contact regions in electrical connection with the functional part through first protected connections extending over or in the chip. A substrate has a first contact area and a second contact area, which is remote from the first contact area. The first contact area carries second electrical contact regions, and the second contact area carries external connection regions. The second contact regions and the external connection regions are in mutual electrical connection through second protected connections extending over or in the substrate. A protection-ring structure surrounds the first and second electrical contact regions and delimits a first chamber closed with respect to the outside. The first electrical contact regions and the second electrical contact regions are in mutual electrical contact.