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公开(公告)号:US20220337958A1
公开(公告)日:2022-10-20
申请号:US17735048
申请日:2022-05-02
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Marco VENERI , Alessandro MORCELLI
Abstract: Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.
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2.
公开(公告)号:US20200314559A1
公开(公告)日:2020-10-01
申请号:US16902875
申请日:2020-06-16
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Marco VENERI , Alessandro MORCELLI
Abstract: Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.
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3.
公开(公告)号:US20180103326A1
公开(公告)日:2018-04-12
申请号:US15840501
申请日:2017-12-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Marco VENERI , Alessandro Morcelli
Abstract: Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.
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