公开(公告)号：US20130120087A1

公开(公告)日：2013-05-16

申请号：US13736913

申请日：2013-01-08

Applicant: STMICROELECTRONICS SA

Inventor： Sébastien PRUVOST ,  Frédéric GIANESSELLO

IPC: H01P3/00

CPC classification number: H01P3/003 ,  H01P3/006 ,  H01P3/082

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.