公开(公告)号：US20150190804A1

公开(公告)日：2015-07-09

申请号：US14663981

申请日：2015-03-20

Applicant: STMicroelectronics, Inc.

Inventor： Massimiliano Pesaturo ,  Robert J. Powell

IPC: B01L3/00 ,  G01B5/00

CPC classification number: B01L3/502707 ,  B01J2219/00317 ,  B01J2219/00466 ,  B01J2219/00702 ,  B01L3/502753 ,  B01L3/502761 ,  B01L2200/0668 ,  B01L2300/16 ,  B01L2300/161 ,  C40B60/10 ,  G01B5/00 ,  Y10T428/24355

Abstract: A micro device includes a substrate and a structure configured to bind to an object or a material, or not to bind to an object or material. The structure has a roughness based on a roughness of the object or material. For example, a microarray includes a substrate and a well positioned in the substrate and configured to bind to a type of bead. The well has a roughness based on a roughness of the type of bead to which the well is configured to bind. The roughness of the well is controlled by controlling a position and number of striations in the side of the well. In another example, a moveable component of a micro device may have a roughness different from a roughness of an adjacent component, to reduce the likelihood of the moveable component sticking to the adjacent component.

Abstract translation: 微型装置包括衬底和构造成结合物体或材料的结构，或不结合物体或材料。 该结构具有基于物体或材料的粗糙度的粗糙度。 例如，微阵列包括基底和定位在基底中并且被配置为结合一种珠粒的孔。 井具有基于井的类型的粗糙度的孔的粗糙度，孔被构造成结合。 井的粗糙度通过控制井的位置和条纹的数量来控制。 在另一示例中，微型装置的可移动部件可以具有与相邻部件的粗糙度不同的粗糙度，以减少可移动部件粘附到相邻部件的可能性。