公开(公告)号：US20200305283A1

公开(公告)日：2020-09-24

申请号：US16815554

申请日：2020-03-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Fabien QUERCIA ,  David AUCHERE ,  Norbert CHEVRIER ,  Fabien CORSAT

IPC: H05K1/18 ,  H05K3/34

Abstract: A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.