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公开(公告)号：US20230378957A1
公开(公告)日：2023-11-23
申请号：US18364950
申请日：2023-08-03
Applicant: STMicroelectronics (Grenoble2) SAS
Inventor： Etienne Cesar
IPC: H03K19/0185 , H03K19/003 , H03K3/011
CPC classification number: H03K19/018521 , H03K19/00384 , H03K19/00369 , H03K3/011
Abstract: An embodiment level converter circuit is configured to receive, as a current supply, a current proportional to temperature.
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