公开(公告)号：US20210223562A1

公开(公告)日：2021-07-22

申请号：US16746670

申请日：2020-01-17

申请人： STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

发明人： Thineshwaran GOPAL KRISHNAN ,  Christopher TOWNSEND

IPC分类号： G02B27/30 ,  G02B27/12 ,  H01S5/42 ,  G01S7/481

摘要： The present disclosure is directed to an electronic device including a sensor having a transmission module configured to provide a plurality of collimated light beams. The transmission module includes a light source and a transmission beam splitter. The transmission beam splitter includes a plurality of lenslets. The transmission beam splitter is configured to receive one or more light beams from the light source and refract the one or more light beams for forming the plurality of collimated light beams.

公开(公告)号：US20210167240A1

公开(公告)日：2021-06-03

申请号：US17172636

申请日：2021-02-10

申请人： STMicroelectronics (Research & Development) Limited

发明人： Thineshwaran GOPAL KRISHNAN ,  Roy DUFFY

IPC分类号： H01L31/107 ,  G02B27/30 ,  G01S17/89 ,  F21V8/00 ,  G02B27/09

摘要： A transmit integrated circuit includes a light source configured to generate a beam of light. A receive integrated circuit includes a first photosensor. A transmit optic is mounted over the transmit and receive integrated circuits. The transmit optic is formed by a prismatic light guide and is configured to receive the beam of light. An annular body region of the transmit optic surrounds a central opening which is aligned with the first photosensor. The annular body region includes a first reflective surface defining the central opening and further includes a ring-shaped light output surface surrounding the central opening. Light is output from the ring-shaped light output surface in response to light which propagates within the prismatic light guide in response to the received beam of light and which reflects off the first reflective surface.

公开(公告)号：US20240061083A1

公开(公告)日：2024-02-22

申请号：US18495608

申请日：2023-10-26

申请人： STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

发明人： Christopher TOWNSEND ,  Thineshwaran GOPAL KRISHNAN ,  James Peter Drummond DOWNING ,  Kevin CHANNON

IPC分类号： G01S7/481 ,  G01J1/44 ,  G01S17/10 ,  G02B27/30 ,  H01S5/42 ,  H01S5/02253

CPC分类号： G01S7/4814 ,  G01J1/44 ,  G01S7/4816 ,  G01S17/10 ,  G02B27/30 ,  H01S5/423 ,  H01S5/02253 ,  G01J2001/4466 ,  G01J2001/448

摘要： An apparatus comprises an array of vertical-cavity surface-emitting lasers. Each of the vertical-cavity surface-emitting lasers is configured to be a source of light. The apparatus also comprises an optical arrangement configured to receive light from a plurality of the vertical-cavity surface-emitting lasers and to output a plurality of light beams.

公开(公告)号：US20200350455A1

公开(公告)日：2020-11-05

申请号：US16401209

申请日：2019-05-02

申请人： STMicroelectronics (Research & Development) Limited

发明人： Thineshwaran GOPAL KRISHNAN ,  Roy DUFFY

IPC分类号： H01L31/107 ,  G02B27/30 ,  G02B27/09 ,  F21V8/00 ,  G01S17/89

摘要： A transmit integrated circuit includes a light source configured to generate a beam of light. A receive integrated circuit includes a first photosensor. A transmit optic is mounted over the transmit and receive integrated circuits. The transmit optic is formed by a prismatic light guide and is configured to receive the beam of light. An annular body region of the transmit optic surrounds a central opening which is aligned with the first photosensor. The annular body region includes a first reflective surface defining the central opening and further includes a ring-shaped light output surface surrounding the central opening. Light is output from the ring-shaped light output surface in response to light which propagates within the prismatic light guide in response to the received beam of light and which reflects off the first reflective surface.