公开(公告)号：US20220140176A1

公开(公告)日：2022-05-05

申请号：US17083669

申请日：2020-10-29

Applicant: STMicroelectronics Asia Pacific Pte Ltd

Inventor： Jaspreet Singh SIDHU ,  Tat Ming TEO

IPC: H01L31/18 ,  G01J1/02 ,  G01J1/04 ,  H01L31/0203

Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.