公开(公告)号：US20240321795A1

公开(公告)日：2024-09-26

申请号：US18603113

申请日：2024-03-12

Applicant: STMicroelectronics International N.V.

Inventor： Olivier ORY ,  Michael DE CRUZ

IPC: H01L23/00 ,  H01L21/288 ,  H01L21/463 ,  H01L21/768 ,  H05K1/18

CPC classification number: H01L24/13 ,  H01L21/288 ,  H01L21/463 ,  H01L21/76865 ,  H01L24/29 ,  H01L24/73 ,  H05K1/181 ,  H01L2224/13007 ,  H01L2224/13025 ,  H01L2224/29005 ,  H01L2224/2919 ,  H01L2224/73153 ,  H01L2924/01029

Abstract: The present disclosure relates to a method of manufacturing first electronic components, each comprising a second electronic component, each second component comprising at least two contact metallizations, the method comprising: a) forming, on a substrate, at least two metal pillars; b) forming, over a portion of the surface of each pillar, a metallization of the component; c) covering the surface of the substrate, the pillars, and the metallizations of the first components with a first resin layer; d) removing the substrate to expose a surface of the pillars, opposite to the metallizations of the components; e) bonding and electrically connecting the second components, by their metallizations, to the surface of the pillars opposite to the metallizations of the first components; and f) expose the surface of the metallizations of the first components opposite to the pillars.

公开(公告)号：US20250096057A1

公开(公告)日：2025-03-20

申请号：US18827353

申请日：2024-09-06

Applicant: STMicroelectronics International N.V.

Inventor： Michael DE CRUZ ,  Laurent BARREAU

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29

Abstract: An electronic component includes an integrated circuit chip and a package surrounding the integrated circuit chip. The electronic component includes at least a first conductive region at least partially coating one side of the integrated circuit chip. The first conductive region includes an alloy predominantly comprising bismuth.