公开(公告)号：US20250015038A1

公开(公告)日：2025-01-09

申请号：US18757887

申请日：2024-06-28

Applicant: STMicroelectronics International N.V.

Inventor： Pierangelo MAGNI ,  Alberto ARRIGONI ,  Giovanni MISSAGLIA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: A semiconductor die is mounted on a substrate having electrically conductive substrate portions. The electrically conductive substrate portions include a die mounting location and electrically conductive leads around the die mounting location. The semiconductor die is mounted on a first surface of the die mounting location. The substrate and the semiconductor die are encapsulated in an electrically insulating encapsulation having a surface opposite the first surface. An electrically conductive path is provided to electrically couple the semiconductor die to one of the electrically conductive substrate portions. The electrically conductive path includes: a first path section extending through and/or over the electrically insulating encapsulation between the electrically conductive substrate portion and an intermediate point at the surface of the electrically insulating encapsulation, and a second path section provided via wire bonding and extending between the semiconductor die and the intermediate point at the surface of the electrically insulating encapsulation.