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公开(公告)号：US20240421176A1
公开(公告)日：2024-12-19
申请号：US18734573
申请日：2024-06-05
Applicant: STMicroelectronics International N.V.
Inventor： Florian Perminjat , Vincent Beix , Yandong Mao , Karine Saxod
IPC: H01L27/146
Abstract: An optical package comprising a support substrate including first electrical contacts, a cap fixed to the support substrate by adhesive and comprising second electrical contacts connected to the first electrical contacts by a soldering material, a separation structure disposed between the soldering material and the adhesive
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