公开(公告)号：US20240421176A1

公开(公告)日：2024-12-19

申请号：US18734573

申请日：2024-06-05

Applicant: STMicroelectronics International N.V.

Inventor： Florian Perminjat ,  Vincent Beix ,  Yandong Mao ,  Karine Saxod

IPC: H01L27/146

Abstract: An optical package comprising a support substrate including first electrical contacts, a cap fixed to the support substrate by adhesive and comprising second electrical contacts connected to the first electrical contacts by a soldering material, a separation structure disposed between the soldering material and the adhesive

公开(公告)号：US11974419B1

公开(公告)日：2024-04-30

申请号：US18209018

申请日：2023-06-13

Applicant: STMicroelectronics International N.V.

Inventor： Florian Perminjat ,  Karine Saxod ,  Etienne Brosse

IPC: H05K9/00 ,  H01L23/552 ,  H01L31/167 ,  H01L23/60

CPC classification number: H05K9/0058 ,  H01L23/552 ,  H01L31/167 ,  H05K9/0084 ,  H05K9/0088 ,  H01L23/60

Abstract: Methods, systems, and apparatuses for electromagnetic shielding are provided, particularly for semiconductor packages and/or printed circuit boards. For example, an optical device covered by an RF can may be attached to a substrate. The RF can may have a first aperture for an optical path of the optical device. A deposition layer may provide electromagnetic shielding in conjunction with the RF can. The deposition layer may include one or more portions that are deposited at the same time, including a first portion with an aperture that narrows the aperture of the RF can. The deposition layer, after being deposited, may be cured. The deposition layer and RF can may provide electromagnetic shielding for the optical device.