公开(公告)号：US20040105242A1

公开(公告)日：2004-06-03

申请号：US10714760

申请日：2003-11-17

Applicant: STMicroelectronics Limited

Inventor： Paul Evans

IPC: H05K007/10

CPC classification number: H01R12/523 ,  H05K1/144

Abstract: A stackable module for a processor system including a support plate with a set of topside circuit components mounted to its topside, and topside and underside connectors. The module is stackable with other such modules and are provided with conductive tracks that are arranged to convey transport stream data and transport stream control signals between modules in a stack. A stack of such modules in a processor system is also provided.

公开(公告)号：US20020176233A1

公开(公告)日：2002-11-28

申请号：US10085121

申请日：2002-02-27

Applicant: STMicroelectronics Limited

Inventor： Paul Evans

IPC: H05K007/00

CPC classification number: H01R12/523 ,  H05K1/144

Abstract: A stackable module for a processor system including a support plate with a set of topside circuit components mounted to its topside, and topside and underside connectors. The module is stackable with other such modules and are provided with conductive tracks that are arranged to convey transport stream data and transport stream control signals between modules in a stack. A stack of such modules in a processor system is also provided.

Abstract translation: 一种用于处理器系统的可堆叠模块，其包括具有安装到其顶侧的一组顶侧电路部件的支撑板以及顶侧和下侧连接器。 该模块可与其他这样的模块堆叠并且设置有导电轨道，其被布置成在堆叠中的模块之间传送传输流数据和传输流控制信号。 还提供了处理器系统中的这种模块的堆叠。