公开(公告)号：US20130083501A1

公开(公告)日：2013-04-04

申请号：US13630872

申请日：2012-09-28

Applicant: STMicroelectronics Ltd (Malta)

Inventor： Mark A. Azzopardi ,  Kevin Formosa ,  Ivan Ellul

IPC: B32B1/02 ,  B32B15/01 ,  H05K5/03 ,  B23K1/20

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/16152 ,  Y10T428/1241 ,  Y10T428/13 ,  H01L2924/00

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract translation: 一个实施例公开了一种用于将集成电子设备的盖焊接到支撑层的方法，包括以下步骤：提供支撑层; 提供包括第一材料的芯和第二材料的涂层的盖，所述第一和第二材料分别相对于焊料可润湿和不可湿润，所述涂层被布置为暴露所述第一材料的表面 核心; 将盖与支撑层联接; 并通过焊料将芯的表面焊接到支撑层。