公开(公告)号：US20040031973A1

公开(公告)日：2004-02-19

申请号：US10446589

申请日：2003-05-27

Applicant: STMicroelectronics S.r.I

Inventor： Carlo Cognetti ,  Ubaldo Mastromatteo

IPC: H01L027/10

CPC classification number: H01L31/18 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2224/05099

Abstract: A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors in a wafer of semiconductor material; bonding a plate of transparent material to the wafer so as to seal the optical sensors; and dividing the wafer into a plurality of dies, each comprising an optical sensor and a respective portion of the plate.

Abstract translation: 一种用于制造封装的光学传感器的方法，包括以下步骤：在半导体材料的晶片中形成多个相互间隔的光学传感器; 将透明材料板粘合到晶片上以便密封光学传感器; 并将晶片分成多个模具，每个模具包括光学传感器和板的相应部分。