公开(公告)号：US20030026522A1

公开(公告)日：2003-02-06

申请号：US10170020

申请日：2002-06-12

Applicant: STMicroelectronics S.r.I

Inventor： Guido Chiaretti

IPC: G02B006/26 ,  G02B006/12

CPC classification number: G02B6/3582 ,  G02B6/3538 ,  G02B6/3546 ,  G02B6/3576 ,  G02B6/3596 ,  G02B26/004

Abstract: An optical device is formed by a first chip and a second chip bonded together. The first chip (4 has an optical layer of glass housing an optical circuit; the second chip has a body of semiconductor material housing integrated electronic components and coated with a bonding layer of glass fixed directly and contiguous to the optical layer of the first chip. The bonding layer delimits cavities facing corresponding cavities in the first chip in positions corresponding to the intersection points of waveguides constituting the optical circuit. The cavities are filled with a liquid having the same refractive index as the waveguides. Underneath each cavity, in the body of semiconductor material there is present a resistor, which, when traversed by current, causes formation of a bubble inside the chamber and deflection of the light beam traversing a waveguide towards a different waveguide.

Abstract translation: 光学器件由第一芯片和第二芯片结合在一起形成。 第一芯片（4具有容纳光电路的玻璃的光学层;第二芯片具有容纳集成电子部件的半导体材料体，并且涂覆有直接固定并连续于第一芯片的光学层的玻璃结合层。 接合层在与第一芯片中相对应的腔相对应的空腔中限定了与构成光电路的波导的交点相对应的空腔，空腔中填充有与波导相同的折射率的液体，在每个腔体的下方， 半导体材料存在电阻器，当电流穿过时，电阻器在腔室内形成气泡，并且将光束穿过波导朝向不同波导的偏转。