Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure
    1.
    发明申请
    Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure 失效
    用于制造用于非易失性存储器单元矩阵的字节选择晶体管和相应结构的工艺

    公开(公告)号:US20040152267A1

    公开(公告)日:2004-08-05

    申请号:US10715887

    申请日:2003-11-18

    CPC classification number: H01L27/11521 G11C16/0433 H01L27/115 H01L27/11524

    Abstract: A process for manufacturing a byte selection transistor for a matrix of non volatile memory cells organised in rows and columns integrated on a semiconductor substrate, each memory cell comprising a floating gate transistor and a selection transistor, the process providing the following steps: defining on a same semiconductor substrate respective active areas for the byte selection transistor, for the floating gate transistor and for the selection transistor split by portions of insulating layer; depositing a multilayer structure comprising at least a gate oxide layer, a first polysilicon layer, a dielectric layer on the whole substrate and a second polysilicon layer, characterised in that it comprises the following steps: removing through a traditional photolithographic technique the multilayer structure to form at least a couple of two bands developing substantially in a parallel way to the columns of the matrix of memory cells, the first band being effective to define the gate regions of the byte selection transistor and of the selection transistor, the second band being effective to define the gate region of the floating gate transistor, a portion of the first band further extending on the portion of insulating layer which is adjacent to the byte selection transistor, forming an opening in the portion up to expose the first polysilicon layer, forming a conductive layer in the opening to put said first polysilicon layer in electric contact with said second polysilicon layer.

    Abstract translation: 一种用于制造用于集成在半导体衬底上的行和列组织的非易失性存储器单元的矩阵的字节选择晶体管的处理,每个存储单元包括浮置栅晶体管和选择晶体管,该过程提供以下步骤: 相同的半导体衬底用于字节选择晶体管的相应有效区域,用于浮置栅极晶体管和用于分离绝缘层的选择晶体管; 沉积包括至少栅极氧化物层,第一多晶硅层,整个衬底上的电介质层和第二多晶硅层的多层结构,其特征在于其包括以下步骤:通过传统的光刻技术去除形成的多层结构 至少两个条带基本上以并行方式发展到存储器单元矩阵的列,第一条带有效地限定字节选择晶体管和选择晶体管的栅极区域,第二条带有效地 限定浮栅晶体管的栅极区,第一带的一部分在绝缘层的与字节选择晶体管相邻的部分上进一步延伸,在该部分中形成开口以暴露第一多晶硅层,形成导电 以使所述第一多晶硅层与所述第二多晶硅层电接触。

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