公开(公告)号：US10197794B2

公开(公告)日：2019-02-05

申请号：US15603614

申请日：2017-05-24

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia Costantini ,  Marta Carminati ,  Daniela Angela Luisa Gatti ,  Laura Maria Castoldi ,  Roberto Carminati

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B26/10

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

公开(公告)号：US10649202B2

公开(公告)日：2020-05-12

申请号：US16225881

申请日：2018-12-19

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia Costantini ,  Marta Carminati ,  Daniela Angela Luisa Gatti ,  Laura Maria Castoldi ,  Roberto Carminati

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B26/10

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

公开(公告)号：US20180180871A1

公开(公告)日：2018-06-28

申请号：US15603614

申请日：2017-05-24

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia Costantini ,  Marta Carminati ,  Daniela Angela Luisa Gatti ,  Laura Maria Castoldi ,  Roberto Carminati

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0307 ,  B81B2203/058 ,  B81C1/00714 ,  B81C2203/032 ,  G02B26/105

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.