公开(公告)号：US11889765B2

公开(公告)日：2024-01-30

申请号：US17181432

申请日：2021-02-22

Applicant: STMicroelectronics S.r.l.

Inventor： Gianluca Longoni ,  Luca Seghizzi

IPC: B81B3/00 ,  H10N30/20 ,  H02N2/18 ,  H10N30/05 ,  H10N30/074 ,  H10N30/85 ,  H10N30/00

CPC classification number: H10N30/2042 ,  B81B3/0021 ,  H02N2/186 ,  H10N30/05 ,  H10N30/074 ,  H10N30/10513 ,  H10N30/85 ,  B81B2203/0118

Abstract: A MEMS device is provided that includes a semiconductor substrate including a main surface extending perpendicular to a first direction and a side surface extending on a plane parallel to the first direction and to a second direction that is perpendicular to the first direction. At least one cantilevered member protrudes from the side surface of the semiconductor substrate along a third direction that is perpendicular to the first and second directions. The at least one cantilevered member includes a body portion that includes a piezoelectric material. The body portion has a length along the third direction, a height along the first direction and a width along the second direction, and the height is greater than the width. The at least one cantilevered member is configured to vibrate by lateral bending along a direction perpendicular to the first direction.