公开(公告)号：US20150294942A1

公开(公告)日：2015-10-15

申请号：US14750466

申请日：2015-06-25

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro Freguglia ,  Luca Pividori

IPC: H01L23/544 ,  H01L21/02 ,  H01L21/78

CPC classification number: H01L23/544 ,  H01L21/02065 ,  H01L21/78 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for indexing electronic devices includes: forming first chips in a first wafer, forming second chips in a second wafer, forming the electronic devices by coupling each first chip with a corresponding second chip, and forming an index on each electronic device. The index is indicative of a position of the corresponding first chip in the first wafer. The step of forming an index includes forming a first portion of the index on the first chip, and forming a second portion of the index on the second chip.

Abstract translation: 一种用于索引电子设备的方法包括：在第一晶片中形成第一芯片，在第二晶片中形成第二芯片，通过将每个第一芯片与相应的第二芯片耦合形成电子器件，并在每个电子器件上形成指数。 索引表示第一晶片中对应的第一芯片的位置。 形成索引的步骤包括在第一芯片上形成索引的第一部分，并在第二芯片上形成索引的第二部分。

公开(公告)号：US10109590B2

公开(公告)日：2018-10-23

申请号：US14750466

申请日：2015-06-25

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro Freguglia ,  Luca Pividori

IPC: H01L23/544 ,  H01L21/02 ,  H01L21/78

Abstract: A method for indexing electronic devices includes: forming first chips in a first wafer, forming second chips in a second wafer, forming the electronic devices by coupling each first chip with a corresponding second chip, and forming an index on each electronic device. The index is indicative of a position of the corresponding first chip in the first wafer. The step of forming an index includes forming a first portion of the index on the first chip, and forming a second portion of the index on the second chip.