Abstract:
A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate of semiconductor material; a rigid electrode, at least in part of conductive material, coupled to the substrate; a membrane, at least in part of conductive material, facing the rigid electrode and coupled to the substrate, which undergoes deformation in the presence of incident acoustic pressure waves and is arranged between the substrate and the rigid electrode and has a first surface and a second surface, in fluid communication, respectively, with a first chamber and a second chamber, the first chamber being delimited at least in part by a first wall portion and by a second wall portion formed by the substrate, and the second chamber being delimited at least in part by the rigid electrode; and a stopper element, connected between the first and second wall portions for limiting the deformations of the membrane. At least one electrode-anchorage element couples the rigid electrode to the stopper element.