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公开(公告)号：US20240327199A1
公开(公告)日：2024-10-03
申请号：US18614435
申请日：2024-03-22
CPC分类号： B81B3/0051 , B81B2201/0235 , B81B2201/0242
摘要： Microelectromechanical device comprising a supporting body, containing semiconductor material and a movable mass, constrained to the supporting body with a relative degree of freedom with respect to at least one motion direction, within a range of admissible positions. The device also comprises stopper elements, operable by the movable mass due to movements along the at least one motion direction and configured to apply stop forces to opposite sides of the movable mass, transversely to the at least one motion direction, when the movable mass reaches a respective endpoint of the range of admissible positions, so as to prevent the movable mass from exceeding the respective endpoint.
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公开(公告)号：US20240199408A1
公开(公告)日：2024-06-20
申请号：US18590533
申请日：2024-02-28
发明人： Giorgio ALLEGATO , Lorenzo CORSO , Ilaria GELMI , Carlo VALZASINA
CPC分类号： B81B3/0051 , B81C1/00595 , B81B2201/0235 , B81B2201/0242 , B81C2201/0198
摘要： A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.
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公开(公告)号：US20240174508A1
公开(公告)日：2024-05-30
申请号：US18434743
申请日：2024-02-06
申请人： xMEMS Labs, Inc.
CPC分类号： B81B3/0021 , B81B3/0051 , B81B3/0072 , H04R31/00 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2207/03
摘要： A wearable sound device includes a venting module, configured to form at least one vent to connect a volume within the wearable sound device and ambient, and a sound producing device, configured to produce sound according to an equalized input signal. The venting module, including at least one venting device, operates among a plurality of statuses corresponding to a plurality of degrees of opening. A controller generates the equalized input signal according to a degree of opening among the plurality of degrees of opening, in order to counteract a roll off caused by the at least one vent.
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公开(公告)号：US20240051816A1
公开(公告)日：2024-02-15
申请号：US18448710
申请日：2023-08-11
发明人： Pekka LEHTINEN , Akira Konno , Matti Liukku
IPC分类号： B81B3/00
CPC分类号： B81B3/001 , B81B3/0051 , B81B2201/0235 , B81B2201/0242 , B81B2203/056
摘要： A microelectromechanical element is provided that includes a first device part and a second device part, and a motion-limiting structure having a first stopper bump and a second stopper bump. The first and second stopper bumps extend from the first device part toward the second device part. When one of the device parts moves toward the other device part in the out-of-plane direction and crosses a displacement threshold, the first stopper bump comes into contact with the second device part before the second stopper bump contacts the second device part, and the second stopper bump comes into contact with the second device part before the first device part contacts with the second device part.
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公开(公告)号：US20230382724A1
公开(公告)日：2023-11-30
申请号：US17825225
申请日：2022-05-26
发明人： Wen-Chuan Tai , Hsiang-Fu Chen , Chia-Ming Hung , I-Hsuan Chiu , Fan Hu
CPC分类号： B81C1/00801 , B81B3/0051 , B81B2203/0127 , B81C2201/053
摘要： Various embodiments of the present disclosure are directed towards an integrated chip including an interconnect structure overlying a semiconductor substrate. An upper dielectric structure overlies the interconnect structure. A microelectromechanical system (MEMS) substrate overlies the upper dielectric structure. A cavity is defined between the MEMS substrate and the upper dielectric structure. The MEMS substrate comprises a movable membrane over the cavity. A cavity electrode is disposed in the upper dielectric structure and underlies the cavity. A plurality of stopper structures is disposed in the cavity between the movable membrane and the cavity electrode. A dielectric protection layer is disposed along a top surface of the cavity electrode. The dielectric protection layer has a greater dielectric constant than the upper dielectric structure.
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公开(公告)号：US20230192476A1
公开(公告)日：2023-06-22
申请号：US18167884
申请日：2023-02-12
发明人： CHEN HSIUNG YANG , CHUN-WEN CHENG , CHIA-HUA CHU , EN-CHAN CHEN
CPC分类号： B81B3/0051 , B81C1/00158 , B81B2201/0257 , H04R19/04
摘要： A MEMS device includes a first multi-layer structure, a second multi-layer structure over the first multi-layer structure, a first semiconductor layer between the first and second multilayer structures, a first air gap separating the first multi-layer structure and the first semiconductor layer, a second air gap separating the first semiconductor layer and the second multi-layer structure, a plurality of semiconductor pillars, and a plurality of second semiconductor pillars. The first semiconductor pillars are exposed to the first air gap, and coupled to the first semiconductor layer and the first multi-layer structure. The second semiconductor pillars are exposed to the second air gap, and coupled to the first semiconductor layer and the second multi-layer structure.
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公开(公告)号：US20230174370A1
公开(公告)日：2023-06-08
申请号：US18161263
申请日：2023-01-30
发明人： Fengpei SUN , Zhihong FENG , Jinghui XU , Xiaoshi DONG
CPC分类号： B81B3/0051 , B81B3/001 , B81C1/00341 , G02B26/0841 , G02B26/0858 , G02B26/085 , B81B2201/042 , B81B2203/0136 , B81C2203/03
摘要： An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.
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公开(公告)号：US20230171549A1
公开(公告)日：2023-06-01
申请号：US18059886
申请日：2022-11-29
发明人： Michael CARFORE
CPC分类号： H04R17/00 , B81B3/0051 , H04R2201/003 , B81B2201/0257
摘要： Aspects of transducers with feedback transduction are described. One aspect is a transducer system comprising an operational amplifier having an inverting input, a non-inverting input, and an output. The transducer system also includes a piezoelectric microelectromechanical system (MEMS) transducer having a first node and a second node, wherein the first node is coupled to the inverting input of the operational amplifier, and wherein the piezoelectric MEMS transducer is configured to generate an electrical signal across the first node and the second node in response to a signal incident upon the piezoelectric MEMS transducer. The transducer system also includes an attenuator having an input and an output, wherein the input of the attenuator is coupled to the output of the operational amplifier, and wherein the output of the attenuator is coupled to the second node of the piezoelectric MEMS transducer.
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公开(公告)号：US20180354780A1
公开(公告)日：2018-12-13
申请号：US15562726
申请日：2016-04-07
CPC分类号： B81B3/0051 , B81B3/0021 , B81C1/00055 , B81C1/00119 , B81C1/00388 , B81C1/00531 , B81C1/00714
摘要： A MEMS device and a method of forming the same. A disclosed method includes: providing a silicon substrate layer, a buried oxide layer and a device silicon layer; using a microfabrication process to pattern a set of device features on the device silicon layer including a shuttle mass and an anchor frame; removing the silicon substrate layer and buried oxide below the shuttle mass; placing a shadow mask on a surface of the device silicon layer, wherein the shadow mask has an microscale opening to expose at least one device feature; and forming a nanoscale stopper on a sidewall of the at least one device feature by depositing a deposition material through the opening in a controlled manner.
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公开(公告)号：US20180188127A1
公开(公告)日：2018-07-05
申请号：US15736436
申请日：2016-06-14
CPC分类号： G01L9/0047 , B81B3/0051 , B81B2201/0264 , B81C1/00182 , G01L9/0042 , G01L9/0073 , G01L19/0618
摘要： According to an example aspect of the present invention, there is provided a MEMS capacitive pressure sensor (1), comprising a first electrode (17), a deformable second electrode (18) being electrically insulated from the first electrode (17) by means of a chamber (4) between the first electrode (17) and the second electrode (18), and wherein at least one of the first electrode (17) and the second electrode (18) includes at least one pedestal (5) protruding into the chamber (4). According to another example aspect of the present invention, there is also provided a method for manufacturing a MEMS capacitive pressure sensor (1).
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