公开(公告)号：US20220068788A1

公开(公告)日：2022-03-03

申请号：US17412007

申请日：2021-08-25

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics SDN BHD

Inventor： Andrea ALBERTINETTI ,  Marifi Corregidor CAGUD

IPC: H01L23/498 ,  H01L23/00

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

公开(公告)号：US20240120267A1

公开(公告)日：2024-04-11

申请号：US18390544

申请日：2023-12-20

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics SDN BHD

Inventor： Andrea ALBERTINETTI ,  Marifi Corregidor CAGUD

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29019 ,  H01L2224/83192

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.