公开(公告)号：US20130028450A1

公开(公告)日：2013-01-31

申请号：US13646249

申请日：2012-10-05

Applicant: STMicroelectronics S.r.l. ,  Unimicron Technology Corp.

Inventor： Mario Cortese ,  Mark A. Azzopardi ,  Shih-Ping Hsu ,  Kun-Chen Tsai ,  Ivan Micallef

IPC: H04R1/00 ,  B32B38/08 ,  B32B3/02 ,  B32B38/04 ,  H01L27/20 ,  H05K1/11

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0118 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  Y10T156/1056 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

Abstract translation: MEMS器件的盖子及相关制造方法。 所述盖包括：分别具有相对的第一和第二表面的第一板，其分别设置有第一和第二金属层，其中通孔延伸穿过所述第一板和所述第一和第二金属层; 具有相对的第三和第四表面的第二板; 夹在第一板的第二表面和第二板的第三表面之间的粘合剂层，以将第一和第二板连接在一起，使得通孔被第二板封闭，从而形成凹部; 以及涂覆凹部的底部和侧表面的第一导体层。