公开(公告)号：US08902025B2

公开(公告)日：2014-12-02

申请号：US13736913

申请日：2013-01-08

Applicant: STMicroelectronics SA

Inventor： Sébastien Pruvost ,  Frédéric Gianessello

IPC: H01P5/00 ,  H01P3/06 ,  H01P3/00

CPC classification number: H01P3/003 ,  H01P3/006 ,  H01P3/082

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract translation: 一个实施例涉及一种共面波导电子器件，其包括其上安装有信号带和至少一个接地平面的衬底。 信号带包括电连接在一起的相同级别的金属化的多条信号线，并且接地平面由导电材料制成并且包括多个孔。