公开(公告)号：US20210251106A1

公开(公告)日：2021-08-12

申请号：US16887534

申请日：2020-05-29

Applicant: SULFURSCIENCE TECHNOLOGY CO., LTD.

Inventor： ZHEN-YU JUANG ,  SUNG-YEN WEI ,  CHIA-CHIN CHENG

IPC: H05K7/20

Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.