公开(公告)号：US11246238B2

公开(公告)日：2022-02-08

申请号：US16887534

申请日：2020-05-29

Applicant: SULFURSCIENCE TECHNOLOGY CO., LTD. ,  MING CHI UNIVERSITY OF TECHNOLOGY

Inventor： Zhen-Yu Juang ,  Sung-Yen Wei ,  Chia-Chin Cheng ,  Chien-Kuo Hsieh

IPC: H05K7/20

Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.

公开(公告)号：US20210251106A1

公开(公告)日：2021-08-12

申请号：US16887534

申请日：2020-05-29

Applicant: SULFURSCIENCE TECHNOLOGY CO., LTD.

Inventor： ZHEN-YU JUANG ,  SUNG-YEN WEI ,  CHIA-CHIN CHENG

IPC: H05K7/20

Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.

公开(公告)号：US10580957B2

公开(公告)日：2020-03-03

申请号：US15700591

申请日：2017-09-11

Applicant: SULFURSCIENCE TECHNOLOGY CO., LTD

Inventor： Zhen-Yu Juang ,  Ho-Wei Wang ,  Sung-Yen Wei

IPC: B32B9/04 ,  H01L37/02 ,  B32B5/16

Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.

公开(公告)号：US20180138388A1

公开(公告)日：2018-05-17

申请号：US15700591

申请日：2017-09-11

Applicant: SULFURSCIENCE TECHNOLOGY CO., LTD

Inventor： Zhen-Yu JUANG ,  Ho-Wei WANG

IPC: H01L37/02 ,  B32B5/16 ,  B32B9/04

Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.