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公开(公告)号：US10262914B2
公开(公告)日：2019-04-16
申请号：US15775275
申请日：2016-11-28
发明人： Katsushi Yamashita , Yui Takahashi
IPC分类号： H01L23/29 , C08K3/36 , C08L79/00 , C08L101/00 , H01L23/31 , C08K3/08 , C08L79/08 , H01L23/00
摘要： Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.
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公开(公告)号：US10224259B2
公开(公告)日：2019-03-05
申请号：US14898966
申请日：2014-06-11
发明人： Yui Ozaki , Katsushi Yamashita , Tomomasa Kashino
IPC分类号： C08K3/36 , H01L23/29 , H01L23/495 , C08G73/02 , C08K5/357 , C08K5/3445 , C08K5/378 , C08K5/548 , H01L21/56 , H01L29/16 , H01L29/20 , C08G73/12 , C08K5/35 , H01L23/31
摘要： The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler.In the general formulae (1), (2-1) and (2-2), each of X2, X3 and X4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula “—SO2—” or “—CO—”, an oxygen atom or a single bond.
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