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公开(公告)号：US10224259B2
公开(公告)日：2019-03-05
申请号：US14898966
申请日：2014-06-11
发明人： Yui Ozaki , Katsushi Yamashita , Tomomasa Kashino
IPC分类号： C08K3/36 , H01L23/29 , H01L23/495 , C08G73/02 , C08K5/357 , C08K5/3445 , C08K5/378 , C08K5/548 , H01L21/56 , H01L29/16 , H01L29/20 , C08G73/12 , C08K5/35 , H01L23/31
摘要： The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler.In the general formulae (1), (2-1) and (2-2), each of X2, X3 and X4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula “—SO2—” or “—CO—”, an oxygen atom or a single bond.
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公开(公告)号：US20230018491A1
公开(公告)日：2023-01-19
申请号：US17781734
申请日：2020-12-09
发明人： Tomomasa Kashino , Tadasuke Endo , Akiyoshi Oba
IPC分类号： C08G59/24 , C08K5/5435 , C08K3/38 , H01L23/373
摘要： A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.
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公开(公告)号：US20230095959A1
公开(公告)日：2023-03-30
申请号：US17801575
申请日：2021-02-24
发明人： Tadasuke Endo , Tomomasa Kashino
摘要： The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m·K) or higher.
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公开(公告)号：US20220372208A1
公开(公告)日：2022-11-24
申请号：US17619265
申请日：2020-06-17
IPC分类号： C08G59/24 , C08G59/50 , C08K3/38 , B32B15/092
摘要： Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m·K) or higher. In addition, a volume resistivity R200 of the cured product at 200° C. is preferably 1.0×1010 Ω·m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.
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