公开(公告)号：US11512233B2

公开(公告)日：2022-11-29

申请号：US17040358

申请日：2019-03-20

申请人： SUMITOMO BAKELITE CO., LTD.

发明人： Kazufusa Onodera ,  Hironari Inaba

IPC分类号： C09J7/24 ,  C09J123/06 ,  C09J133/08 ,  C09J133/10 ,  C09J153/02 ,  C09J123/12 ,  C09J123/04 ,  B29C48/08 ,  B29C48/07 ,  B29C48/21 ,  B29C51/14 ,  G02B1/14 ,  G02B5/30 ,  B32B7/12 ,  B32B23/08 ,  B32B27/08 ,  B32B27/34 ,  C09J7/38 ,  C09J7/29 ,  B32B27/36

摘要： A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

公开(公告)号：US11584870B2

公开(公告)日：2023-02-21

申请号：US17269759

申请日：2019-08-21

申请人： SUMITOMO BAKELITE CO., LTD.

发明人： Hironari Inaba ,  Kazufusa Onodera

IPC分类号： B32B7/12 ,  B32B23/08 ,  B32B27/08 ,  B32B27/34 ,  G02B1/14 ,  G02B5/30 ,  B29C51/10 ,  B29C48/07 ,  B29C48/21 ,  B29C51/14 ,  C09J7/29 ,  C09J123/06 ,  C09J133/08 ,  C09J133/10 ,  C09J153/02 ,  C09J123/04 ,  C09J123/12 ,  C09J7/38 ,  B29C53/04

摘要： A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.