HEAT CONDUCTIVE SHEET AND STRUCTURE
    2.
    发明申请
    HEAT CONDUCTIVE SHEET AND STRUCTURE 审中-公开
    导热片和结构

    公开(公告)号:US20150371923A1

    公开(公告)日:2015-12-24

    申请号:US14765095

    申请日:2014-01-17

    Abstract: Provided is a heat conductive sheet obtained by including a heat conductive filler in a cured organic resin, in which the heat conductive filler is made of multiple particles obtained by coating surfaces of plastic particles with a heat conductive material, and a coefficient of variation (CV) value of particle diameters of the particles, which is computed using Equation (1) described below, is equal to or less than 10%. CV value (%) of particle diameters=standard deviation of particle diameters/arithmetic average particle diameter dn×100  (1)

    Abstract translation: 提供一种导热片,其通过在固化有机树脂中包含导热填料而获得,其中导热填料由通过用导热材料涂覆塑料颗粒的表面获得的多个颗粒和变异系数(CV )使用下述等式(1)计算的粒子的粒径等于或小于10%。 粒径的CV值(%)=粒径的标准偏差/算术平均粒径dn×100(1)

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