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1.发明申请METAL FOIL-CLAD SUBSTRATE, CIRCUIT BOARD AND HEATING-ELEMENT MOUNTING SUBSTRATE 审中-公开金属箔基板，电路板和加热元件安装基板公开(公告)号：US20150366047A1
公开(公告)日：2015-12-17
申请号：US14732051
申请日：2015-06-05
Applicant: SUMITOMO BAKELITE CO., LTD.
Inventor： Shu Okasaka , Toshio Komiyatani , Koji Koizumi , Takayuki Baba
CPC classification number: H05K1/021 , H05K1/0281 , H05K1/189 , H05K2201/066 , H05K2201/10106 , H05K2201/10166 , Y10T428/24628 , Y10T428/24752
Abstract: A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting a heat element is provided. The metal foil-clad substrate includes: a metal foil having one surface; a resin layer formed on the one surface of the metal foil; a heat radiation metal plate formed on a surface of the resin layer opposite to the metal foil; an insulating part formed on the surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or a solidified material of a second resin composition containing a resin material.
Abstract translation: 提供了用于形成电路板安装并电连接加热元件的金属箔包覆基板。 金属箔包覆基板包括：具有一个表面的金属箔; 形成在所述金属箔的一个表面上的树脂层; 形成在与金属箔相反的树脂层的表面上的散热金属板; 形成在与金属箔相反的树脂层的表面上的绝缘部; 以及金属箔，树脂层和绝缘部弯曲到金属箔或绝缘部的一侧的至少一个弯曲部。 绝缘部由含有第一热固性树脂的第一树脂组合物的固化物构成。 树脂层由包含树脂材料的第二树脂组合物的固化材料或固化材料构成。
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Patent Agency Ranking
2.发明申请METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD 审中-公开基于金属的安装板和配有金属安装板的会员公开(公告)号：US20150351224A1
公开(公告)日：2015-12-03
申请号：US14728144
申请日：2015-06-02
Applicant: SUMITOMO BAKELITE CO., LTD.
Inventor： Yoshihide Nii , Toshio Komiyatani , Yukiharu Yuzuriha
CPC classification number: H05K1/05 , H05K2201/09745 , H05K2201/10166
Abstract: A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.
Abstract translation: 根据本发明的金属基安装板包括：金属基电路板，包括具有第一表面和与第一表面相对的第二表面的金属基板，设置在金属基板的第一表面上的绝缘膜和 设置在绝缘膜上的金属膜; 以及设置在所述金属基电路板的金属膜上的电子部件，其中，在所述金属基板内的情况下，与所述多个线的集合重叠的区域各自具有45°以下的角度， 在金属基安装基板的法线上，将各电子元件的面向金属膜的表面的线定义为第一区域，将第一区域以外的区域定义为第二区域， 在第二区域内设置槽，但不设置在第一区域内。
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3.发明申请METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD 审中-公开基于金属的安装板和配有金属安装板的会员公开(公告)号：US20150351223A1
公开(公告)日：2015-12-03
申请号：US14728125
申请日：2015-06-02
Applicant: SUMITOMO BAKELITE CO., LTD.
Inventor： Yoshihide Nii , Toshio Komiyatani , Yukiharu Yuzuriha
CPC classification number: H05K1/05 , H05K2201/09745 , H05K2201/10166
Abstract: The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board. Within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region. A region other than the first region is defined as a second region. At least one groove is provided within the first region so as to surround the electronic component in a planar view of the metal-based mounting board.
Abstract translation: 金属基安装板包括：金属基电路板，包括具有第一表面和第二表面的金属基板，设置在第一表面上的绝缘膜和设置在绝缘膜上的金属膜; 以及设置在金属基电路板的金属膜上的电子部件。 在金属基板内，与金属基安装基板的法线相比，重叠于多个相互成45度以下的角度的集合的区域，各条线通过电子表面 面向金属膜的部件被定义为第一区域。 除了第一区域之外的区域被定义为第二区域。 在第一区域内设置至少一个凹槽，以便在金属基安装板的平面视图中围绕电子部件。
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4.发明申请METAL FOIL-CLAD SUBSTRATE, CIRCUIT BOARD AND ELECTRONIC-COMPONENT MOUNTING SUBSTRATE 审中-公开金属箔基板，电路板和电子元件安装基板公开(公告)号：US20150366054A1
公开(公告)日：2015-12-17
申请号：US14732994
申请日：2015-06-08
Applicant: SUMITOMO BAKELITE CO., LTD.
Inventor： Shu Okasaka , Toshio Komiyatani , Koji Koizumi , Takayuki Baba
CPC classification number: H05K1/0216 , B32B15/08 , B32B27/20 , B32B27/38 , B32B2255/06 , B32B2255/26 , B32B2307/202 , B32B2307/304 , B32B2457/08 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H05K1/0243 , H05K1/0284 , H05K1/036 , H05K1/0373 , H05K3/0014 , H05K2201/0209 , H05K2201/0215 , Y10T428/24628 , H01L2924/00012 , H01L2924/00014
Abstract: A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting an electronic component is provided. The metal foil-clad substrate includes a metal foil having a one surface, a resin layer formed on the one surface of the metal foil; an insulating part formed on a surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or solidified material of a second resin composition containing a resin material.
Abstract translation: 提供了用于形成电路板安装和电连接电子部件的金属箔包覆基板。 覆盖金属箔的基板包括具有一个表面的金属箔，形成在金属箔的一个表面上的树脂层; 绝缘部，形成在与所述金属箔相反的树脂层的表面上; 以及至少一个弯曲部分，其中金属箔，树脂层和绝缘部分弯曲到金属箔或绝缘部分的一侧。 绝缘部由含有第一热固性树脂的第一树脂组合物的固化物构成。 树脂层由包含树脂材料的第二树脂组合物的固化材料或固化材料构成。
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公开(公告)号：US20150371923A1
公开(公告)日：2015-12-24
申请号：US14765095
申请日：2014-01-17
Applicant: SUMITOMO BAKELITE CO., LTD.
Inventor： Toshio Komiyatani , Shogo Nakano , Tatsumi Kawaguchi
IPC: H01L23/373
CPC classification number: H01L23/3737 , C08J5/18 , C08J2325/06 , H01L2924/0002 , H05K7/20481 , H01L2924/00
Abstract: Provided is a heat conductive sheet obtained by including a heat conductive filler in a cured organic resin, in which the heat conductive filler is made of multiple particles obtained by coating surfaces of plastic particles with a heat conductive material, and a coefficient of variation (CV) value of particle diameters of the particles, which is computed using Equation (1) described below, is equal to or less than 10%. CV value (%) of particle diameters=standard deviation of particle diameters/arithmetic average particle diameter dn×100 (1)
Abstract translation: 提供一种导热片，其通过在固化有机树脂中包含导热填料而获得，其中导热填料由通过用导热材料涂覆塑料颗粒的表面获得的多个颗粒和变异系数（CV ）使用下述等式（1）计算的粒子的粒径等于或小于10％。 粒径的CV值（％）=粒径的标准偏差/算术平均粒径dn×100（1）
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6.发明申请METAL-BASED MOUNTING BOARD AND METHOD OF MANUFACTURING METAL-BASED MOUNTING BOARD 审中-公开基于金属的安装板和制造金属安装板的方法公开(公告)号：US20150351225A1
公开(公告)日：2015-12-03
申请号：US14728150
申请日：2015-06-02
Applicant: SUMITOMO BAKELITE CO., LTD.
Inventor： Yoshihide Nii , Toshio Komiyatani , Yukiharu Yuzuriha
CPC classification number: H05K1/184 , H01L2224/16 , H01L2224/16225 , H01L2924/13055 , H01L2924/13091 , H05K1/021 , H05K1/056 , H05K3/3447 , H01L2924/00
Abstract: A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate through which a through-hole is provided along a thickness direction thereof, an insulating film provided on the metal substrate and a metal film provided on the insulating film, wherein the through-hole opens on a surface of the metal film on the opposite side of the metal substrate via the insulating film and the metal film; an electronic component connected to the metal film, the electronic component including an electronic component main body and a conductive leg portion electrically connected to the electronic component main body and inserted into the through-hole; and an insulating portion provided at least between the leg portion locating inside the through-hole and the metal substrate, and having a function of preventing them from making contact with each other.
Abstract translation: 根据本发明的金属基安装板包括：金属基电路板，包括金属基板，通过该金属基板沿其厚度方向设置通孔，设置在金属基板上的绝缘膜和设置在金属基板上的金属膜 在所述绝缘膜上，所述通孔经由所述绝缘膜和所述金属膜在所述金属基板的相反侧的所述金属膜的表面上开口; 连接到所述金属膜的电子部件，所述电子部件包括电子部件主体和电连接到所述电子部件主体并插入所述通孔的导电性支腿部; 以及至少设置在位于所述通孔内的所述脚部与所述金属基板之间的绝缘部，并且具有防止它们彼此接触的功能。
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