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公开(公告)号：US20210143122A1
公开(公告)日：2021-05-13
申请号：US17047760
申请日：2019-04-08
摘要： The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent. In a case where SP1 represents a Hansen's method-based average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent in the resin composition, and Mn1 represents a number average molecular weight of the resin group, SP1 and Mn1 satisfy Mn1≤210×SP1−4,095.
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公开(公告)号：US20210078113A1
公开(公告)日：2021-03-18
申请号：US17049617
申请日：2019-04-15
IPC分类号： B23K35/362 , B23K35/02 , B23K35/36 , B23K35/26
摘要： Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and has a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a N2 atmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.
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公开(公告)号：US20240326177A1
公开(公告)日：2024-10-03
申请号：US18694473
申请日：2022-10-04
IPC分类号： B23K35/362 , B23K35/02
CPC分类号： B23K35/362 , B23K35/025
摘要： A flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. AC1 has a rate of decrease in weight of 20% by mass or less in a case of being held at 140° C. for 15 minutes. S1 has a rate of decrease in weight of 50% by mass or less in a case of being held at 140° C. for 15 minutes.
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公开(公告)号：US20210060713A1
公开(公告)日：2021-03-04
申请号：US16644362
申请日：2018-09-06
IPC分类号： B23K35/362
摘要： A flux is provided which maintains activity by suppressing formation of an ester due to a reaction between an organic acid and a hydroxy group of an alcohol contained in a solvent and improves solderability.
The flux includes: 40 mass % to 90 mass % of water; 2 mass % to 15 mass % of an organic acid; and greater than 0 mass % and less than or equal to 48 mass % of a solvent having a hydroxy group, in which when a molar mass % of all organic acid carboxyl group unit contained in the organic acid is regarded as 100 unit mol %, the content ratio of all carboxylic acid ester unit esterified by the organic acid and the hydroxy group which is contained in the solvent is 0 unit mol % to 50 unit mol %.
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