公开(公告)号：US20210068255A1

公开(公告)日：2021-03-04

申请号：US16488755

申请日：2018-02-26

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Tsuyoshi TAKEMOTO ,  Hiroshi UEDA

IPC: H05K1/16 ,  H05K1/02

Abstract: A flexible printed circuit board includes: an electrically insulating substrate layer; an electrically conductive pattern stacked on at least one surface of the substrate layer; and a cover layer that is disposed on a stack including the substrate layer and the electrically conductive pattern and covers a surface of the stack, which surface is on the side on which the electrically conductive pattern is present. The electrically conductive pattern has a coil region including a coil. In the substrate layer or the cover layer, a high-magnetic permeability member is present in at least a region that overlaps the coil region in plan view.