公开(公告)号：US20240075575A1

公开(公告)日：2024-03-07

申请号：US18365514

申请日：2023-08-04

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yuki KINPARA ,  Taku ICHIYOSHI ,  Satoyoshi INUI ,  Toru SUGAMATA

IPC: B23Q11/12 ,  B23Q3/154 ,  H02N13/00

CPC classification number: B23Q11/126 ,  B23Q3/1543 ,  H02N13/00

Abstract: An electrostatic chuck device comprising: a plate-shaped electrostatic chuck part which has an electrostatic adsorption electrode provided therein and has a mounting surface on which a plate-shaped sample is mounted; and a base part which supports the electrostatic chuck part on a support surface thereof from an opposite side of the mounting surface, wherein the base part has a disk shape which has a central axis at a center thereof, and a coolant channel extending along the support surface is provided inside the base part, wherein the coolant channel includes an outer peripheral channel which overlaps an outer edge of the plate-shaped sample when viewed from an axial direction of the central axis, and an inner peripheral channel which is disposed on an inner side in a radical direction than the outer peripheral channel, wherein at least a portion of the inner peripheral channel extends spirally around the central axis, and a channel cross-sectional area of the inner peripheral channel decreases as a distance from the central axis increases.

公开(公告)号：US20250069931A1

公开(公告)日：2025-02-27

申请号：US18721088

申请日：2022-12-09

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Satoyoshi INUI ,  Taku ICHIYOSHI ,  Takeshi OTSUKA

IPC: H01L21/683

Abstract: Provided is an electrostatic chuck member including: a dielectric substrate having a placement surface on which a sample is mounted, wherein the dielectric substrate comprises a first supporting plate and a second supporting plate which are stacked in a thickness direction thereof; and an adsorption electrode embedded in the dielectric substrate, in which a gas flow path is provided by a recessed groove, which is provided between the first supporting plate and the second supporting plate which have surfaces facing each other, wherein the recessed groove is formed in at least one of the surfaces thereof and is covered with the other thereof, a dimension of the gas flow path in a height direction is 90 μm or more and 300 μm or less, and a width dimension of the gas flow path is 500 μm or more and less than 3000 μm.