OPTICAL MODULATOR
    2.
    发明申请

    公开(公告)号:US20210302766A1

    公开(公告)日:2021-09-30

    申请号:US17170034

    申请日:2021-02-08

    Abstract: An optical modulator includes a substrate on which an optical waveguide and a modulation electrode that modulates a light wave propagating through the optical waveguide are formed, and a case housing the substrate, the optical waveguide includes at least an optical branching part that branches one light wave into two light waves or an optical combining part that combines two light waves into one light wave, the modulation electrode has a signal electrode and a ground electrode, and a part of the signal electrode is disposed so as to cross the optical branching part or the optical combining part, and the optical modulator is provided with a suppressing unit that suppresses changes in an intensity ratio of the light waves branched at the optical branching part or an intensity ratio of the light waves combined at the optical combining part, by the signal electrode.

    OPTICAL MODULATOR MODULE
    3.
    发明申请

    公开(公告)号:US20180095301A1

    公开(公告)日:2018-04-05

    申请号:US15719582

    申请日:2017-09-29

    CPC classification number: G02F1/0102 G02F1/011 G02F1/0123 G02F1/035 G02F1/225

    Abstract: Provided is an optical modulator module including a waveguide substrate in which an optical waveguide and control electrodes (signal electrode, DC bias electrodes, and the like) for controlling a light wave propagating through the optical waveguide are formed, a relay substrate which is disposed in the vicinity of the waveguide substrate and in which a DC bias wiring for supplying a DC bias voltage to the control electrodes (DC bias electrodes) is formed, and a package case which stores the waveguide substrate and the relay substrate. A loop of wire standing from the relay substrate to a position higher than a top surface of the waveguide substrate is provided in a part of the DC bias wiring. The loop of wire is disposed inside the package case at a position within 10 mm from any one of locations where a solder is used.

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