公开(公告)号：US4685034A

公开(公告)日：1987-08-04

申请号：US830485

申请日：1986-02-18

申请人： Sadayuki Tetsu ,  Yasuo Tanishima

发明人： Sadayuki Tetsu ,  Yasuo Tanishima

IPC分类号： H05K9/00 ,  H05K5/04 ,  H05K5/06 ,  H05K7/02 ,  H02B1/08

CPC分类号： H05K5/04 ,  H05K7/02

摘要： An electronic device includes a case having a partitional wall dividing the case interior into a first compartment and a second compartment and having one or more interrupting walls in the first compartment. Substrates are disposed in the first compartment and are arrayed in rows, with the interrupting wall being interposed between the adjacent rows. A circuit board is disposed in the second compartment and is electrically connected to the integrated circuits by elements extending through the partitional wall. A signal input terminal and a signal output terminal for the substrates are disposed at one side wall of the case. This structure makes it possible to realize a small-sized device, easy mounting and demounting of the substrates, and unvarying electrical characteristics.

摘要翻译： 电子设备包括具有将壳体内部分成第一隔间和第二隔室并将第一隔间中具有一个或多个中断壁的分隔壁的壳体。 基板设置在第一隔室中并且排列成行，其中中断壁插入在相邻行之间。 电路板设置在第二隔间中，并通过分隔壁延伸的元件与集成电路电连接。 用于基板的信号输入端子和信号输出端子设置在壳体的一个侧壁处。 这种结构使得可以实现小型装置，容易地安装和拆卸基板以及不变的电特性。

公开(公告)号：US5406026A

公开(公告)日：1995-04-11

申请号：US232457

申请日：1994-04-22

申请人： Akiyoshi Yamaguchi ,  Yuji Hasegawa ,  Manabu Miyamoto ,  Minoru Suzuki ,  Koichi Abe ,  Hideki Sonobe ,  Sadayuki Tetsu

发明人： Akiyoshi Yamaguchi ,  Yuji Hasegawa ,  Manabu Miyamoto ,  Minoru Suzuki ,  Koichi Abe ,  Hideki Sonobe ,  Sadayuki Tetsu

IPC分类号： H05K7/18 ,  H05K9/00

CPC分类号： H05K7/186

摘要： A frame structure for a communication system includes a framework for accommodating a communication system and a cover member mounted on the framework. The cover member has an insulating material layer provided between a semiconducting material layer and a conducting material layer, and is mounted so that the conducting material layer will face inside. The semiconducting material layer and the conducting material layer are electrically connected to each other.

摘要翻译： 用于通信系统的帧结构包括用于容纳通信系统的框架和安装在框架上的覆盖构件。 盖构件具有设置在半导体材料层和导电材料层之间的绝缘材料层，并且安装成导电材料层将面向内部。 半导体材料层和导电材料层彼此电连接。