-
1.发明授权公开(公告)号：US11515283B2
公开(公告)日：2022-11-29
申请号：US16799811
申请日：2020-02-24
Applicant: Samsung Display Co., LTD.
Inventor： Chung-Seok Lee , Joongmok Lee , Eunjeong Jeon
Abstract: A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.
Search Results
1
records
(took 0.012 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
